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TEL+86-189-3887-0191
EMAIL448711171@qq.com
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2026-04The Technological Pull and Challenges in the Quartz Industry in the Era of 12 - inch Wafers.In the process of the semiconductor industrys full - scale migration to 12 - inch (300mm) wafers, quartz materials and their products not only contin…
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2026-02Based on the latest industry data and market trends in 2026, high-speed, high-precision diamond wire multi-wire cutting machines are currently experiencing an accelerated phase of technological iteration and a critical period of domestic sub…
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2025-12Application Analysis in the Semiconductor Industry1. Wafer Cutting and Processing ApplicationsIn the field of semiconductor manufacturing, diamond wire multi-wire saws are primarily used for precision cutting and processing of wafers. These …
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2025-111. Specific application of silicon wafer production processIn the photovoltaic industry chain, diamond wire multi wire cutting machines are mainly used in two key links of silicon wafer manufacturing: silicon ingot square cutting and silicon…
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2025-111. Working principle and technical characteristicsDiamond wire multi wire cutting machine is an advanced equipment that uses high-speed moving diamond wire for precision grinding and cutting of materials. The core working principle is to fix…
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2025-10Material Properties1. High melting point: The melting point of tungsten is 3422 ℃, and the melting point of molybdenum is 2623 ℃. The alloy formed by the two has a very high melting point, usually between 2600 ℃ and 3400 ℃. This enables …
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