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2026-03Tianjing TJ3000 Trial Cutting Report: Overcoming the Mass Production Bottleneck of 12-Inch Sapphire 1.25mm Thin WafersAbstract: In response to the technical pain points in the evolution of 12-inch sapphire substrates towards larger sizes and…
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2026-02Based on the latest industry data and market trends in 2026, high-speed, high-precision diamond wire multi-wire cutting machines are currently experiencing an accelerated phase of technological iteration and a critical period of domestic sub…
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2025-12The Unsung Heroes of Semiconductor Manufacturing: Ceramic Materials and Diamond Wire Multi-Line Slicing MachinesIn the semiconductor industry, where precision reaches the nanoscale, ceramic materials and diamond wire multi-line slicing machi…
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2025-12When it comes to choosing a mobile phone film, the sapphire mobile phone film stands out with numerous advantages. Compared with ordinary PET films, the sapphire film has a much higher hardness. With a Mohs hardness of 9, second only to diam…
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2025-12Application Analysis in the Semiconductor Industry1. Wafer Cutting and Processing ApplicationsIn the field of semiconductor manufacturing, diamond wire multi-wire saws are primarily used for precision cutting and processing of wafers. These …
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2025-111. Specific application of silicon wafer production processIn the photovoltaic industry chain, diamond wire multi wire cutting machines are mainly used in two key links of silicon wafer manufacturing: silicon ingot square cutting and silicon…
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