-
TEL -
+86-189-3887-0191
-
EMAIL -
448711171@qq.com
TEL+86-189-3887-0191
EMAIL448711171@qq.com
13
2025-111. Specific application of silicon wafer production processIn the photovoltaic industry chain, diamond wire multi wire cutting machines are mainly used in two key links of silicon wafer manufacturing: silicon ingot square cutting and silicon…
03
2025-111. Working principle and technical characteristicsDiamond wire multi wire cutting machine is an advanced equipment that uses high-speed moving diamond wire for precision grinding and cutting of materials. The core working principle is to fix…
30
2025-10Material Properties1. High melting point: The melting point of tungsten is 3422 ℃, and the melting point of molybdenum is 2623 ℃. The alloy formed by the two has a very high melting point, usually between 2600 ℃ and 3400 ℃. This enables …
22
2025-09Silicon Carbide - Innovative Engine for Energy and CommunicationIn the field of new energy vehicles, 12 inch silicon carbide slices are of great significance. Compared to 8 inches, the substrate area of 12 inches is about 2.25 times larger, …
21
2019-11The market demand of the industry determines the direction of industrial development. Nanjing Weilan New Material Technology Co., Ltd., the application of sapphire as a 3C consumer electronics industry, has greatly promoted the development o…
21
2019-11An important means to improve the process parameters of the fast wire processing is multiple cuttingMultiple cutting is like removing the machining allowance through roughing, semi-finishing and finishing in conventional gold processing. The…
Address: No. 190 Shenzhen East Road, Economic and Technological Development, Huai'an City, Jiangsu Province
Tel: +86-189-3887-0191
E-mail: yao.zhang@tianjingzb.com
Copyright: COPYRIGHT © 2019 ALL RIGHTS RESERVED
National service hotline：
189-3887-0191Copyright © 2019 All Rights Reserved All rights reserved：Tianjing Equipment
