1. Working principle and technical characteristics

Diamond wire multi wire cutting machine is an advanced equipment that uses high-speed moving diamond wire for precision grinding and cutting of materials. The core working principle is to fix diamond particles on the steel wire through electroplating or resin solidification technology, forming an efficient cutting tool. During the cutting process, the diamond wire moves back and forth or unidirectionally at a high speed of 0-3000m/s, cutting the material through the grinding effect of diamond particles.

The uniqueness of multi wire cutting technology lies in the use of multiple parallel arranged diamond wires for simultaneous cutting, which rotate at high speed to form dynamic cutting surfaces. When the workpiece moves along the cutting surface, the diamond wire acts like countless small and sharp blades, gradually cutting the material into pieces. This technology can achieve cutting multiple workpieces at once, greatly improving production efficiency.

Modern diamond wire multi wire cutting machines are equipped with advanced tension control systems and high-precision guide wheel systems. The cutting line tension can be precisely adjusted within the range of 0-300N, and the tension control accuracy reaches within 0.1N of the maximum range. At the same time, the equipment adopts a 0.01mm level dynamic tension control system to accurately regulate the stress distribution of the wire mesh, ensuring the stability and consistency of the cutting process.

2. Core technological advantages

The diamond wire multi wire cutting machine has several significant technical advantages compared to traditional cutting methods. Firstly, it has high cutting accuracy, with a cutting path width of only 0.1-0.3mm and low material loss, which can meet the requirements of precision machining. The cutting accuracy can reach within ± 0.01mm, and the repeated positioning accuracy is within ± 0.03mm.

Secondly, the cutting efficiency has been significantly improved. Diamond wire cutting is several times or even tens of times faster than traditional cutting tools, and its cutting efficiency is 10-15 times that of traditional sand saws. In the cutting of photovoltaic silicon wafers, the average single piece cutting time is reduced by 30% compared to traditional methods.

The third is strong material adaptability. Diamond wire cutting technology can cut conductive and non-conductive materials, especially suitable for hard and brittle materials that are difficult to process with traditional cutting tools, such as crystals, ceramics, composite materials, etc. The cutting thickness range is wide, and the slice thickness can reach 0.1mm.

The fourth is excellent surface quality. After cutting, the surface roughness is low, the edges are smooth and intact, and there are no cracks. The cutting surface can achieve a mirror effect, reducing or eliminating subsequent grinding processes.

The fifth is environmental friendliness. Using water-based cutting fluid, the working environment is cleaner, and the noise generated during the cutting process is reduced by 50% compared to traditional row saws.