The product name：TJ3000 12 inch specialized multi wire cutting machine

This model is a high-speed and high-precision machine developed by our company for cutting sapphire substrates on 12 inch semiconductor wafers. Widely applicable for large-sized and ultra-thin cutting of silicon carbide, sapphire, ceramics, precious metals, quartz, and optical glass.

This model adopts a cutting method where the material swings down from top to bottom and the diamond wire remains stationary. It is equipped with a fully servo motor system and stable tension control, resulting in extremely high operational accuracy and stability. The maximum operating speed of diamond wire reaches 2500 meters per minute, with efficient cutting and significantly increased production capacity. The cutting thickness range is from 0.1MM to 20MM, which can meet the needs of different scenarios. It is a high-performance and widely used cutting equipment.

本机型是我公司针对12英寸半导体晶圆蓝宝石衬底切割研发的高速高精度机型。广泛适用于碳化硅、蓝宝石、陶瓷、贵重金属、石英石、光学玻璃的大尺寸和超薄切割。

该机型采用物料从上至下摇摆下降，金刚线静止的切割方式，全伺服电机系统，搭配稳定的张力控制，作业精度与稳定性极高。金刚石线最高运行速度达2500米每分钟，切割高效，大幅提升产能。切割厚度范围在 0.1MM - 20MM，可满足不同场景需求，是一款性能卓越、应用广泛的切割设备。