The product name：TJ2020 Multi functional Multi wire Cutting Machine

  This model is developed and produced by our company, which integrates cutting and winding functions, and has a swinging function, greatly improving cutting and cutting efficiency. It is versatile. Widely applicable for small and medium-sized and ultra-thin cutting of photovoltaic materials, sapphire, ceramics, precious metals, quartz, semiconductor materials, optical glass, laminated glass.

  This model adopts a cutting method of material swinging descent and diamond wire stationary, with a fully servo motor system and stable tension control, achieving extremely high precision and stability in operation. The maximum operating speed of diamond wire reaches 1000 meters per minute, and the cutting speed of winding and cutting is 800 meters per minute, making cutting efficient and significantly increasing production capacity. The cutting thickness range is 0.4MM-10MM, which can meet the needs of different scenarios. It is a high-performance and widely used cutting equipment.

本机型是我公司研发生产的集切割、绕线多功能于一体， 且具备摇摆功能，极大的提高开刃与切割效率，一机多用。广泛适用于碳化硅、蓝宝石、陶瓷、贵重金属、石英石、半导体材料、光学玻璃、夹胶玻璃的大尺寸和超薄切割。

该机型采用物料摇摆下降，金刚线静止的切割方式，全伺服电机系统，搭配稳定的张力控制，作业精度与稳定性极高。金刚石线最高运行速度达1000 米每分钟，绕线开刃速度800 米每分钟，切割高效，大幅提升产能。切割厚度范围在 0.4MM - 10MM，可满足不同场景需求，是一款性能卓越、应用广泛的切割设备。