The product name：TJ2000Diamond wire/multi wire/high-speed/high-precision/descending/swinging cutting machine

This model is designed by our company for the multi line slicing requirements of hard and brittle materials. Widely applicable for large-sized and ultra-thin cutting of silicon carbide, sapphire, ceramics, precious metals, quartz, semiconductor materials, optical glass, and laminated glass.

This model adopts a cutting method where the material swings down from top to bottom and the diamond wire remains stationary. It is equipped with a fully servo motor system and stable tension control, resulting in extremely high operational accuracy and stability. The maximum operating speed of diamond wire reaches 2000 meters per minute, with efficient cutting and significantly increased production capacity. The cutting thickness range is from 0.1MM to 20MM, which can meet the needs of different scenarios. It is a high-performance and widely used cutting equipment.

   本机型是我公司针对硬脆材料的多线切片需求而设计的一款机型。广泛适用于碳化硅、蓝宝石、陶瓷、贵重金属、石英石、半导体材料、光学玻璃、夹胶玻璃的大尺寸和超薄切割。

   该机型采用物料从上至下摇摆下降，金刚线静止的切割方式，全伺服电机系统，搭配稳定的张力控制，作业精度与稳定性极高。金刚石线最高运行速度达2000米每分钟，切割高效，大幅提升产能。切割厚度范围在 0.1MM - 20MM，可满足不同场景需求，是一款性能卓越、应用广泛的切割设备。