本机型是我公司针对硬脆材料的切片的多线使用需求而设计的一款机型,并且具有双工位,切割效率更高,一机多用。广泛适用于碳化硅、蓝宝石、陶瓷、贵重金属、石英石、半导体材料、光学玻璃、加胶玻璃等,的大尺寸和超薄切割。
该机型采用上升式摇摆切割的方式,全伺服电机系统,搭配稳定的张力控制,作业精度与稳定性极高。金刚石线最高运行速度达1500 米每分钟,切割高效,大幅提升产能。切割厚度范围在 1.4MM - 50MM,可满足不同场景需求,是一款性能卓越、应用广泛的切割设备。
This model is designed by our company for the multi line use of slicing of hard and brittle materials, and has dual stations for higher cutting efficiency, making it versatile. Widely applicable for large-sized and ultra-thin cutting of silicon carbide, sapphire, ceramics, precious metals, quartz, semiconductor materials, optical glass, laminated glass, etc.
This model adopts an upward swing cutting method, a fully servo motor system, and stable tension control, with extremely high precision and stability in operation. The maximum operating speed of diamond wire reaches 1500 meters per minute, with efficient cutting and significantly increased production capacity. The cutting thickness range is from 1.4MM to 50MM, which can meet the needs of different scenarios. It is a high-performance and widely used cutting equipment.
